GovBidScope
Deadline passed

Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.

NATIONAL AERONAUTICS AND SPACE ADMINISTRATION

Plain-English Summary

The National Aeronautics And Space Administration is looking for photonic integrated circuit packaging service for 8 pics. includes wore bonding to pcb, fiber alignment and bonding of faus and associated process development and engineering costs.. Response deadline has passed (August 12, 2026).

Contract Details

Solicitation #
80NSSC26939631Q
Type
Special Notice
NAICS Code
813920
PSC Code
6099
Posted
August 10, 2026
Response Deadline
August 12, 2026

Agency & Contact

Department
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-agency
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office
NASA SHARED SERVICES CENTER
Point of Contact
kacey Hickman
kacey.l.hickman@nasa.gov
Will Garrett
will.c.garrett@nasa.gov

Who Should Bid

  • Businesses classified under NAICS 813920
  • Open to all businesses (no set-aside restrictions)
  • Must be registered in SAM.gov with active status
  • Must have relevant past performance or capability statement

Tips for Winning This Contract

  • Contact the contracting officer with questions BEFORE the deadline — they want to help qualified bidders
  • Review the full solicitation documents on SAM.gov for detailed requirements
  • Check if there's an industry day or Q&A session listed
View Full Solicitation on SAM.gov

Download attachments, full requirements, and submit your response on SAM.gov

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